COMe Type6计算模块

Product

Focus on technical applications such as motion control data acquisition and br equipment IoT

COM Express Type6 computing module

cExpress-BW

Product Features:

  • Intel Atom x5 E8000, Pentium N3710 and Celeron N3160/N3060/N3010 Series System-on-Chip (codename: Braswell)

  • Up to 8 GB dual channel DDR3L at 1600 MHz

  • 3x DDI, 1x eDP (optional LVDS in place of eDP), and suppoorting 3 independent displays

  • GbE, three PCIe x1 (opt. five PCIe x1 with bridge)

  • 2x SATA 6Gb/s (SATA0, SATA1)

  • 4x USB 3.0/2.0 and 4x USB 2.0

  • Smart Embedded Management Agent (SEMA®) functions


Specification

Specifications
Model Name                        cExpress-BW    
Core System

CPU

Dual or quad-core Intel® Pentium®, Celeron® N3000 Series and Atom™ SoC,

14nm process (formerly “Braswell”)

Intel® Pentium® N3710, 1.6/2.56 (Burst) GHz, 400/700 (Turbo), 6W (4C)

Intel® Celeron® N3160, 1.6/2.24 (Burst) GHz, 320/640 (Turbo), 6W (4C)

Intel® Celeron® N3060, 1.6/2.48 (Burst) GHz, 320/600 (Turbo), 6W (2C)

Intel® Celeron® N3010, 1.04/2.24 (Burst) GHz, 320/600 (Turbo), 4W (2C)

Intel® Atom™ X5-E8000, 1.04/2.0 (Burst) GHz, 320(no Turbo), 5W (4C)

Memory

Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 8GB in dual SODIMM socket

Embedded BIOS   

AMI EFI with CMOS backup in 8MB SPI BIOS

Cache2MB for Pentium®, Celeron® and Atom™
Expansion Busses

3x PCIe x1: Lanes 0/1/2 (build option 5x PCIe x1 with bridge) LPC bus, SMBus (system) , I2C (user)

SEMA Board Controller

Supports voltage/current monitoring, power sequence debug support, AT/

ATX mode control, logistics and forensic information, flat panel control,general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fancontrol

Debug Headers

40-pin multipurpose flat cable connector for DB-40 debug module providing BIOS POST code LEDs, BMC access, SPI BIOS flashing, power testpoints,debug LEDs 60-pin XDP header for ICE debug of CPU

Video
Supports

3 independent and simultaneous display combinations of DisplayPort/HDMI/

eDP monitors (optional LVDS in place of eDP)

GPU Feature SupportEncode/transcode of HD video content

Supports 3D rendering, media compositing and video encoding

Full hardware acceleration for decode of HEVC, H.264, SVC, VP8, VP9,

MPEG4, AVS, H.263

Full hardware acceleration for encode of H.264, SVC, VP8, VP9, AVS, H.263

Supports content protection using PAVP2.0, HDCP 1.4/2.1 and Media Vault

DRM

DirectX 11.1 support

OpenGL 4.2, ES 3.0 and OpenCL 1.2 support

Note: Availability of features dependent on operating system.

LVDS/eDP

eDP support (shared with DDI3)

Single/dual channel 18/24-bit LVDS (build option in place of eDP)

Digital Display InterfaceDDI1 supporting DisplayPort/HDMI

DDI2 supporting DisplayPort/HDMI

DDI3 supporting DisplayPort/HDMI (shared with LVDS/eDP)

Note: Only two simultaneous HDMI outputs supported.

Audio

Chipset

                  Intel® HD Audio integrated in SoC

Audio Codec           On Express-BASE6 carrier (ALC886 standard support)
Ethernet

MAC/PHY

                 Intel® Ethernet Controller i211AT
Interface                    10/100/1000 GbE connection
I/O Interfaces
USB

4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0(USB 4,5,6,7, port 4-7 from USB hub)

SATA

2x SATA 6Gb/s (SATA0, SATA1) Optional onboard SSD (8/16/32GB) in place of SATA1 port

Serial     2 UART ports COM 1/2 (COM 1 supports console redirection)
GPIO/SD

   4 GPO and 4 GPI SD muxed with GPIO, switched by BIOS setting

Super I/O

  Supported on carrier if needed (standard support for W83627DHG-P)

TPM (build option)
Chipset                       Atmel AT97SC3204
Type                           TPM 1.2
Power
Standard Input              ATX: 12V±5%/5Vsb ±5%, or AT: 12V±5%
Wide Input                   5-20 V/5Vsb ±5%, or AT: 5-20V
Management

ACPI 5.0 compliant, Smart Battery support

Power States

C1-C6, S0, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)

ECO modeSupports deep S5 mode for power saving
Mechanical and Environmental
Form Factor                   PICMG COM.0: Rev 2.1 Type 6
Dimension

                   Compact size: 95 mm x 95 mm

Operating Temperature

                   Standard: 0°C to 60°C  

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,

Table 214-I, Condition D

HALTThermal Stress, Vibration Stress, Thermal Shock and Combined Test
Operating Systems
Standard Support

Windows 10 64-bit, Linux 64-bit, VxWorks 64-bit (TBD))

Extended Support (BSP)

WES7 32/64-bit, Linux 32/64-bit, VxWorks 32-bit