Product
Focus on technical applications such as motion control data acquisition and br equipment IoT
■Intel Atom x5 E8000, Pentium N3710 and Celeron N3160/N3060/N3010 Series System-on-Chip (codename: Braswell)
■Up to 8 GB dual channel DDR3L at 1600 MHz
■3x DDI, 1x eDP (optional LVDS in place of eDP), and suppoorting 3 independent displays
■GbE, three PCIe x1 (opt. five PCIe x1 with bridge)
■2x SATA 6Gb/s (SATA0, SATA1)
■4x USB 3.0/2.0 and 4x USB 2.0
■Smart Embedded Management Agent (SEMA®) functions
Specifications | |||
Model Name | cExpress-BW | ||
Core System | |||
CPU | Dual or quad-core Intel® Pentium®, Celeron® N3000 Series and Atom™ SoC, 14nm process (formerly “Braswell”) Intel® Pentium® N3710, 1.6/2.56 (Burst) GHz, 400/700 (Turbo), 6W (4C) Intel® Celeron® N3160, 1.6/2.24 (Burst) GHz, 320/640 (Turbo), 6W (4C) Intel® Celeron® N3060, 1.6/2.48 (Burst) GHz, 320/600 (Turbo), 6W (2C) Intel® Celeron® N3010, 1.04/2.24 (Burst) GHz, 320/600 (Turbo), 4W (2C) Intel® Atom™ X5-E8000, 1.04/2.0 (Burst) GHz, 320(no Turbo), 5W (4C) | ||
Memory | Dual channel non-ECC 1600/1333 MHz DDR3L memory up to 8GB in dual SODIMM socket | ||
Embedded BIOS | AMI EFI with CMOS backup in 8MB SPI BIOS | ||
Cache | 2MB for Pentium®, Celeron® and Atom™ | ||
Expansion Busses | 3x PCIe x1: Lanes 0/1/2 (build option 5x PCIe x1 with bridge) LPC bus, SMBus (system) , I2C (user) | ||
SEMA Board Controller | Supports voltage/current monitoring, power sequence debug support, AT/ ATX mode control, logistics and forensic information, flat panel control,general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fancontrol | ||
Debug Headers | 40-pin multipurpose flat cable connector for DB-40 debug module providing BIOS POST code LEDs, BMC access, SPI BIOS flashing, power testpoints,debug LEDs 60-pin XDP header for ICE debug of CPU | ||
Video | |||
Supports | 3 independent and simultaneous display combinations of DisplayPort/HDMI/ eDP monitors (optional LVDS in place of eDP) | ||
GPU Feature Support | Encode/transcode of HD video content Supports 3D rendering, media compositing and video encoding Full hardware acceleration for decode of HEVC, H.264, SVC, VP8, VP9, MPEG4, AVS, H.263 Full hardware acceleration for encode of H.264, SVC, VP8, VP9, AVS, H.263 Supports content protection using PAVP2.0, HDCP 1.4/2.1 and Media Vault DRM DirectX 11.1 support OpenGL 4.2, ES 3.0 and OpenCL 1.2 support Note: Availability of features dependent on operating system. | ||
LVDS/eDP | eDP support (shared with DDI3) Single/dual channel 18/24-bit LVDS (build option in place of eDP) | ||
Digital Display Interface | DDI1 supporting DisplayPort/HDMI DDI2 supporting DisplayPort/HDMI DDI3 supporting DisplayPort/HDMI (shared with LVDS/eDP) Note: Only two simultaneous HDMI outputs supported. | ||
Audio | |||
Chipset | Intel® HD Audio integrated in SoC | ||
Audio Codec | On Express-BASE6 carrier (ALC886 standard support) | ||
Ethernet | |||
MAC/PHY | Intel® Ethernet Controller i211AT | ||
Interface | 10/100/1000 GbE connection | ||
I/O Interfaces | |||
USB | 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0(USB 4,5,6,7, port 4-7 from USB hub) | ||
SATA | 2x SATA 6Gb/s (SATA0, SATA1) Optional onboard SSD (8/16/32GB) in place of SATA1 port | ||
Serial | 2 UART ports COM 1/2 (COM 1 supports console redirection) | ||
GPIO/SD | 4 GPO and 4 GPI SD muxed with GPIO, switched by BIOS setting | ||
Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) | ||
TPM (build option) | |||
Chipset | Atmel AT97SC3204 | ||
Type | TPM 1.2 | ||
Power | |||
Standard Input | ATX: 12V±5%/5Vsb ±5%, or AT: 12V±5% | ||
Wide Input | 5-20 V/5Vsb ±5%, or AT: 5-20V | ||
Management | ACPI 5.0 compliant, Smart Battery support | ||
Power States | C1-C6, S0, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) | ||
ECO mode | Supports deep S5 mode for power saving | ||
Mechanical and Environmental | |||
Form Factor | PICMG COM.0: Rev 2.1 Type 6 | ||
Dimension | Compact size: 95 mm x 95 mm | ||
Operating Temperature | Standard: 0°C to 60°C | ||
Humidity | 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D | ||
HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test | ||
Operating Systems | |||
Standard Support | Windows 10 64-bit, Linux 64-bit, VxWorks 64-bit (TBD)) | ||
Extended Support (BSP) | WES7 32/64-bit, Linux 32/64-bit, VxWorks 32-bit |