Product
Focus on technical applications such as motion control data acquisition and br equipment IoT
■Intel Atom® E3900 series (formerly codename: Apollo Lake)and Pentium®/Celeron® SOC, supporting fullvirtualization (VT-d/VT-x)
■ Supports IEEE 1588 Precision Time Protocol (PTP)
■ Up to 8GB dual channel non-ECC DDR3L at 1867/1600 MHz
■ Two DDI channels, one LVDS (VGA/eDP by build option),supports up to 3 independent displays
■ Up to Five PCIe x1 Gen2 (configurable to x2, x4)
■ Two SATA 6 Gb/s, three USB 3.0/2.0, five USB 2.0 and eMMC 5.0(build option)
■ Extreme Rugged operating temperature: -40°C to +85°C(build option for E39XX SKUs)
Specifications | |||
Model Name | cExpress-AL | ||
Core System | |||
CPU | Intel Atom® E3900 series (formerly codename: Apollo Lake)/Pentium®/ Celeron® SoC on 14nm process Atom® E3950 1.6/2.0GHz (Turbo), 12W (4C/1866) Atom® E3940 1.6/1.8GHz (Turbo), 9W (4C/1866) Atom® E3930 1.3/1.8GHz (Turbo), 6W (2C/1866) Pentium® N4200 1.1/2.5GHz (Turbo), 6W (4C/1866) Celeron® N3350 1.1/2.3GHz (Turbo), 6W (2C/1866) Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, IA 32-bit, Intel® AES-NI, dual or quad Out-of-Order Execution (OOE) processor cores, PCLMULQDQ Instruction DRNG Note: Availability of features may vary between processor SKUs. | ||
Memory | Dual channel 1867/1600 MHz non-ECC DDR3L memory up to 8GB in dual SODIMM socket(maximum by 2pcs 4GB or 1pcs 8GB SO-DIMM) | ||
Embedded BIOS | AMI EFI with CMOS backup in 16MB SPI BIOS | ||
Expansion Busses | Up to 5 PCI Express x1 Gen2 (AB): Lanes 0/1/2/3/4 (configurable to x2, x4; up to four simultaneous PCIe devices; lane 4 by build option) LPC bus, SMBus (system) , I2C (user) Note: Optional PCIe bridge IC to support more than four PCIe x1 devices | ||
SEMA Board Controller | Supports: Voltage/current monitoring, power sequence debug support, AT/ ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control | ||
Debug Headers | 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs MIPI60 header for ICE debug of CPU/chipset (build option) | ||
Video | |||
GPU Feature Support | Intel® Gen9 LP Graphics Core, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP/VGA outputs Hardware encode/transcode (including HEVC) DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support OpenGL 4.3 and ES 3.0 support OpenCL 2.0 support | ||
Digital Display Interface | DDI1/2 supporting DisplayPort/HDMI/DVI | ||
VGA | Build option support through DP-to-VGA IC (in place of DDI2) | ||
LVDS | Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC | ||
eDP | 4 lanes support (build option, in place of LVDS) | ||
Audio | |||
Chipset | Intel® HD Audio integrated in SoC | ||
Audio Codec | On carrier Express-BASE6 (ALC886 standard support) | ||
Ethernet | |||
Intel® MAC/PHY | Intel® Ethernet Controller I210 | ||
Interface | 10/100/1000 GbE connection support IEEE 1588 and GbE0_SDP | ||
I/O Interfaces | |||
USB | 3x USB 3.0 (USB ports 0-2) and 5x USB 2.0 (USB ports 3-7)USB OTG support on USB 2.0 port 0 with Yocto Linux | ||
SATA | Two ports SATA 6Gb/s (SATA0,1) | ||
Serial | 2 UART ports | ||
eMMC | eMMC 5.0 (8/16/32GB, build option) | ||
GPIO/SD | 4 GPO and 4 GPI SD signal muxed with GPIO, controlled by BIOS setting Note: eMMC/SD boot device support dependent on OS. | ||
Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) | ||
TPM (build option) | |||
Chipset | Infineon | ||
Type | TPM 2.0 | ||
Power | |||
Standard Input | ATX = 12V±5% / 5Vsb ±5% or AT=12V±5% | ||
Wide Input | ATX = 4.75-20 V / 5Vsb ±5% or AT=4.75-20V (Standard Temp. only) | ||
Management | ACPI 5.0 compliant, Smart Battery support | ||
Power States | C1-C6, S0, S3, S4, S5 and S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) | ||
ECO mode | Supports deep S5 mode for power saving | ||
Mechanical and Environmental | |||
Form Factor | PICMG COM.0: Rev 2.1 Type 6 | ||
Dimension | Compact size: 95 mm x 95 mm | ||
Operating Temperature | Standard: 0°C to 60°C Extreme Rugged: -45°C to +85°C (build option with E3900 series only) | ||
Humidity | 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) | ||
Shock and Vibration | IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D | ||
HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test | ||
Operating Systems | |||
Standard Support | Windows 10 64-bit, Linux 64-bit, VxWorks 64-bit (TBD)) | ||
Extended Support (BSP) | Linux 64-bit, VxWorks 64-bit (TBD) |