COMe Type6计算模块

Product

Focus on technical applications such as motion control data acquisition and br equipment IoT

COM Express Type6 computing module

cExpress-AL

Product Features:

  • Intel Atom® E3900 series (formerly codename: Apollo Lake)and Pentium®/Celeron® SOC, supporting fullvirtualization (VT-d/VT-x)

  • ■ Supports IEEE 1588 Precision Time Protocol (PTP)

  • ■ Up to 8GB dual channel non-ECC DDR3L at 1867/1600 MHz

  • ■ Two DDI channels, one LVDS (VGA/eDP by build option),supports up to 3 independent displays

  • ■ Up to Five PCIe x1 Gen2 (configurable to x2, x4)

  • ■ Two SATA 6 Gb/s, three USB 3.0/2.0, five USB 2.0 and eMMC 5.0(build option)

  • ■ Extreme Rugged operating temperature: -40°C to +85°C(build option for E39XX SKUs)


Specification

Specifications
Model Name                        cExpress-AL    
Core System

CPU

Intel Atom® E3900 series (formerly codename: Apollo Lake)/Pentium®/

Celeron® SoC on 14nm process

Atom® E3950 1.6/2.0GHz (Turbo), 12W (4C/1866)

Atom® E3940 1.6/1.8GHz (Turbo), 9W (4C/1866)

Atom® E3930 1.3/1.8GHz (Turbo), 6W (2C/1866)

Pentium® N4200 1.1/2.5GHz (Turbo), 6W (4C/1866)

Celeron® N3350 1.1/2.3GHz (Turbo), 6W (2C/1866)

Supports: Intel® VT, Intel® VT-d, Intel® TXT, Intel® SSE4.2, Intel® 64

Architecture, IA 32-bit, Intel® AES-NI, dual or quad Out-of-Order Execution

(OOE) processor cores, PCLMULQDQ Instruction DRNG

Note: Availability of features may vary between processor SKUs.

Memory

Dual channel 1867/1600 MHz non-ECC DDR3L memory up to 8GB in dual

SODIMM socket(maximum by 2pcs 4GB or 1pcs 8GB SO-DIMM)

Embedded BIOS   

AMI EFI with CMOS backup in 16MB SPI BIOS

Expansion Busses

Up to 5 PCI Express x1 Gen2 (AB): Lanes 0/1/2/3/4 (configurable to x2, x4;

up to four simultaneous PCIe devices; lane 4 by build option)

LPC bus, SMBus (system) , I2C (user)

Note: Optional PCIe bridge IC to support more than four PCIe x1 devices

SEMA Board Controller

Supports: Voltage/current monitoring, power sequence debug support, AT/

ATX mode control, logistics and forensic information, flat panel control,

general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan

control

Debug Headers

40-pin multipurpose flat cable connector for use with DB-40 debug module

providing BIOS POST code LED, BMC access, SPI BIOS flashing, power

testpoints, debug LEDs

MIPI60 header for ICE debug of CPU/chipset (build option)

Video
GPU Feature Support

Intel® Gen9 LP Graphics Core, supporting 3 independent and simultaneous

display combinations of DisplayPort/HDMI/LVDS or eDP/VGA outputs

Hardware encode/transcode (including HEVC)

DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support

OpenGL 4.3 and ES 3.0 support

OpenCL 2.0 support

Digital Display InterfaceDDI1/2 supporting DisplayPort/HDMI/DVI
VGABuild option support through DP-to-VGA IC (in place of DDI2)
LVDSSingle/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
eDP4 lanes support (build option, in place of LVDS)
Audio

Chipset

Intel® HD Audio integrated in SoC

Audio CodecOn carrier Express-BASE6 (ALC886 standard support)
Ethernet

Intel® MAC/PHY

Intel® Ethernet Controller I210
Interface10/100/1000 GbE connection support IEEE 1588 and GbE0_SDP
I/O Interfaces
USB

3x USB 3.0 (USB ports 0-2) and 5x USB 2.0 (USB ports 3-7)USB OTG support on USB 2.0 port 0 with Yocto Linux

SATA

Two ports SATA 6Gb/s (SATA0,1)

Serial2 UART ports
eMMCeMMC 5.0 (8/16/32GB, build option)
GPIO/SD4 GPO and 4 GPI

SD signal muxed with GPIO, controlled by BIOS setting

Note: eMMC/SD boot device support dependent on OS.

Super I/OSupported on carrier if needed (standard support for W83627DHG-P)
TPM (build option)
ChipsetInfineon
TypeTPM 2.0
Power
Standard InputATX = 12V±5% / 5Vsb ±5% or AT=12V±5%
Wide InputATX = 4.75-20 V / 5Vsb ±5% or AT=4.75-20V (Standard Temp. only)
Management

ACPI 5.0 compliant, Smart Battery support

Power States

C1-C6, S0, S3, S4, S5 and S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)

ECO modeSupports deep S5 mode for power saving
Mechanical and Environmental
Form FactorPICMG COM.0: Rev 2.1 Type 6
Dimension

Compact size: 95 mm x 95 mm

Operating Temperature

Standard: 0°C to 60°C

Extreme Rugged: -45°C to +85°C (build option with E3900 series only)  

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and VibrationIEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

HALTThermal Stress, Vibration Stress, Thermal Shock and Combined Test
Operating Systems
Standard Support

Windows 10 64-bit, Linux 64-bit, VxWorks 64-bit (TBD))

Extended Support (BSP)

Linux 64-bit, VxWorks 64-bit (TBD)