Product
Focus on technical applications such as motion control data acquisition and br equipment IoT
■Intel Atom® E3900 series (formerly codename: Apollo Lake) and
■Pentium®/Celeron® SoC, supporting full virtualization (VT-d/VT-x)
■Up to 8GB Dual Channel soldered non-ECC DDR3L at 1867/1600MHz
■Newest Intel® Gen9 Low Power graphics, up to 4k resolution and H.265 codec
■Four PCIe x1 Gen2 (configurable to x2, x4), GbE
■Two SATA 6 Gb/s, two USB 3.0 and six USB 2.0, eMMC 5.0(build option)
■Supports Smart Embedded Management Agent (SEMA) functions
■Extreme Rugged operating temperature: -40°C to +85°C(build option for E39XX SKUs)
| Specifications | |||
| Model Name | nanoX-AL | ||
| Core System | |||
CPU | Intel Atom® E3900 series (formerly codename: Apollo Lake) and Pentium®/ Celeron® SoC Atom™ E3950 1.6/2.0GHz (Turbo), 12W (4C/1866) Atom™ E3940 1.6/1.8GHz (Turbo), 9W (4C/1866) Atom™ E3930 1.3/1.8GHz (Turbo), 6W (2C/1866) Pentium® N4200 1.1/2.5GHz (Turbo), 6W (4C/1866) Celeron® N3350 1.1/2.3GHz (Turbo), 6W (2C/1866) Supports: Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, IA 32-bit, Intel®AES-NI, dual or quad Out-of-Order Execution (OOE) processor cores, PCLMULQDQ Instruction DRNG Note: Availability of features may vary between processor SKUs. | ||
| Memory | Up to 8 GB Dual channel DDR3L at 1867/1600 MHz non-ECC 2GB is single channel 4/8GB is dual channel | ||
Embedded BIOS | AMI EFI with CMOS backup in 16MB SPI BIOS | ||
| Cache | 2MB for all SKUs | ||
| Expansion Busses | 4 PCI Express x1 Gen2: Lanes 0/1/2/3 (configurable to x2, x4)LPC bus, SMBus (system) , I2C (user) | ||
| SEMA Board Controller | Supports : Voltage/current monitoring, power sequence debug support, AT/ ATX mode control, logistics and forensic information, flat panel control,general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control | ||
| Debug Headers | 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs MIPI60 header for ICE debug of CPU/chipset on break out board (build option) | ||
| Video | |||
| GPU Feature Support | Intel® Generation 9 LP Graphics Core Architecture, supporting 2 independent and simultaneous display combinations of DisplayPort, HDMI, LVDS or eDP outputs Hardware encode/transcode (including HEVC) DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support OpenGL 4.3 and ES 3.0 support OpenCL 2.0 support | ||
| Digital Display Interface | DDI0 supportts DisplayPort/HDMI/DVI | ||
| LVDS | Single channel 18/24-bit LVDS from eDP-to-LVDS IC | ||
| eDP | 4 lane support (build option, in place of LVDS) | ||
| Audio | |||
Chipset | Intel® HD Audio integrated in SoC | ||
| Audio Codec | On carrier miniBASE-10R | ||
| Ethernet | |||
Intel® MAC/PHY | Intel® Ethernet i210 | ||
| Interface | 10/100/1000 GbE connection | ||
| Notes:Intel® Ethernet i211 is supported by project basis,Support IEEE 1588 and GbE0_SDP | |||
| I/O Interfaces | |||
| USB | 2x USB 1.1/2.0/3.0 (USB 0,1) and 6x USB 1.1/2.0 (USB 2,3,4,5,6,7) USB OTG support on USB 2.0 port 7 with Yocto Linux | ||
| SATA | Two ports SATA 6Gb/s (SATA0,1) | ||
| Serial | 2 UART ports | ||
| eMMC | eMMC 5.0 (8/16/32GB, build option) | ||
| GPIO/SD | 4 GPO and 4 GPI SD signal is a build option supported by project basis | ||
| Super I/O | Supported on carrier if needed (standard support for W83627DHG-P) Note: eMMC/SD boot device support depends on OS | ||
| TPM (build option) | |||
| Chipset | Infineon | ||
| Type | TPM2.0 | ||
| Power | |||
| Standard Input | ATX: 12V±5%, 5Vsb ±5%; AT: 12V±5% | ||
| Wide Input | 4.75-20 V, 5Vsb ±5%; AT: 4.75-20V (Standard Temp. only) | ||
| Management | ACPI 5.0 compliant, Smart Battery support | ||
| Power States | C1-C6, S0, S3, S4, S5 and S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) | ||
| ECO mode | Supports deep S5 mode for power saving | ||
| Mechanical and Environmental | |||
| Form Factor | PICMG COM.0 Rev 2.1, Type 10 | ||
| Dimension | Compact size: 84 mm x 55 mm | ||
| Operating Temperature | Standard: 0°C to 60°C Extreme Rugged: -45°C to +85°C (build option with E39XX SoC SKUs) | ||
| Humidity | 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) | ||
| Shock and Vibration | IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D | ||
| HALT | Thermal Stress, Vibration Stress, Thermal Shock and Combined Test | ||
| Operating Systems | |||
| Standard Support | Windows 10 64-bit, Linux 64-bit, VxWorks 64-bit (TBD) | ||
| Extended Support (BSP) | Linux 64-bit, VxWorks 64-bit (TBD) | ||