COMe Type10计算模块

Product

Focus on technical applications such as motion control data acquisition and br equipment IoT

COM Express Type 10 computing module

nanoX-AL

Product Features:

Intel Atom® E3900 series (formerly codename: Apollo Lake) and

Pentium®/Celeron® SoC, supporting full virtualization (VT-d/VT-x)

Up to 8GB Dual Channel soldered non-ECC DDR3L at 1867/1600MHz

Newest Intel® Gen9 Low Power graphics, up to 4k resolution and H.265 codec

Four PCIe x1 Gen2 (configurable to x2, x4), GbE

Two SATA 6 Gb/s, two USB 3.0 and six USB 2.0, eMMC 5.0(build option)

Supports Smart Embedded Management Agent (SEMA) functions

Extreme Rugged operating temperature: -40°C to +85°C(build option for E39XX SKUs)


Specification

Specifications
Model Name                        nanoX-AL    
Core System

CPU

Intel Atom® E3900 series (formerly codename: Apollo Lake) and Pentium®/

Celeron® SoC

Atom™ E3950 1.6/2.0GHz (Turbo), 12W (4C/1866)

Atom™ E3940 1.6/1.8GHz (Turbo), 9W (4C/1866)

Atom™ E3930 1.3/1.8GHz (Turbo), 6W (2C/1866)

Pentium® N4200 1.1/2.5GHz (Turbo), 6W (4C/1866)

Celeron® N3350 1.1/2.3GHz (Turbo), 6W (2C/1866)

Supports: Intel® TXT, Intel® SSE4.2, Intel® 64 Architecture, IA 32-bit, Intel®AES-NI, dual or quad Out-of-Order Execution (OOE) processor cores,

PCLMULQDQ Instruction DRNG

Note: Availability of features may vary between processor SKUs.

Memory

Up to 8 GB Dual channel DDR3L at 1867/1600 MHz non-ECC

2GB is single channel

4/8GB is dual channel

Embedded BIOS   

AMI EFI with CMOS backup in 16MB SPI BIOS

Cache2MB for all SKUs
Expansion Busses

4 PCI Express x1 Gen2: Lanes 0/1/2/3 (configurable to x2, x4)LPC bus, SMBus (system) , I2C (user)

SEMA Board Controller

Supports : Voltage/current monitoring, power sequence debug support, AT/

ATX mode control, logistics and forensic information, flat panel control,general purpose I2C, failsafe BIOS (dual BIOS), watchdog timer and fan control

Debug Headers

40-pin multipurpose flat cable connector for use with DB-40 debug module

providing BIOS POST code LED, BMC access, SPI BIOS flashing, power

testpoints, debug LEDs

MIPI60 header for ICE debug of CPU/chipset on break out board (build option)

Video
GPU Feature Support

Intel® Generation 9 LP Graphics Core Architecture, supporting 2 independent

and simultaneous display combinations of DisplayPort, HDMI, LVDS or eDP

outputs

Hardware encode/transcode (including HEVC)

DirectX 12, DirectX 11.3, DirectX 10, DirectX 9.3 support

OpenGL 4.3 and ES 3.0 support

OpenCL 2.0 support

Digital Display InterfaceDDI0 supportts DisplayPort/HDMI/DVI
LVDS

Single channel 18/24-bit LVDS from eDP-to-LVDS IC

eDP4 lane support (build option, in place of LVDS)
Audio

Chipset

                 Intel® HD Audio integrated in SoC

Audio Codec                     On carrier miniBASE-10R
Ethernet

Intel® MAC/PHY

                      Intel® Ethernet i210
Interface                    10/100/1000 GbE connection
Notes:Intel® Ethernet i211 is supported by project basis,Support IEEE 1588 and GbE0_SDP
I/O Interfaces
USB

2x USB 1.1/2.0/3.0 (USB 0,1) and 6x USB 1.1/2.0 (USB 2,3,4,5,6,7)

USB OTG support on USB 2.0 port 7 with Yocto Linux

SATA

Two ports SATA 6Gb/s (SATA0,1)

Serial2 UART ports
eMMCeMMC 5.0 (8/16/32GB, build option)
GPIO/SD

4 GPO and 4 GPI

SD signal is a build option supported by project basis

Super I/O

Supported on carrier if needed (standard support for W83627DHG-P)

Note: eMMC/SD boot device support depends on OS

TPM (build option)
Chipset                          Infineon
Type                           TPM2.0
Power
Standard Input              ATX: 12V±5%, 5Vsb ±5%; AT: 12V±5%
Wide Input      4.75-20 V, 5Vsb ±5%; AT: 4.75-20V (Standard Temp. only)
Management

           ACPI 5.0 compliant, Smart Battery support

Power States

C1-C6, S0, S3, S4, S5 and S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)

ECO mode              Supports deep S5 mode for power saving
Mechanical and Environmental
Form Factor                   PICMG COM.0 Rev 2.1, Type 10
Dimension

                   Compact size: 84 mm x 55 mm

Operating Temperature

Standard: 0°C to 60°C

Extreme Rugged: -45°C to +85°C (build option with E39XX SoC SKUs) 

Humidity

5-90% RH operating, non-condensing

5-95% RH storage (and operating with conformal coating)

Shock and VibrationIEC 60068-2-64 and IEC-60068-2-27

MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D

HALTThermal Stress, Vibration Stress, Thermal Shock and Combined Test
Operating Systems
Standard Support

Windows 10 64-bit, Linux 64-bit, VxWorks 64-bit (TBD)

Extended Support (BSP)

Linux 64-bit, VxWorks 64-bit (TBD)